SIR172ADP Datasheet, PDF (1/13 Pages) Vishay Telefunken – N-Channel 30 V (D-S) MOSFET

N-Channel 30 V (D-S) MOSFET
SiR172ADP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () Max.
30
0.0085 at V_GS = 10 V
0.0105 at V_GS = 4.5 V
I_D (A)^{a, g}
24
24
Q_g (Typ.)
12.8 nC
PowerPAK SO-8
FEATURES
• TrenchFET^® Power MOSFET
• Low Thermal Resistance PowerPAK^® Package
with Low 1.07 mm Profile
• Optimized for High-Side Synchronous Rectifier
Operation
• 100 % R_g and UIS Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
6.15 mm
S
1
S
5.15 mm
2
S
3
G
4
D
8
D
7
D
6
D
5
Bottom View
Ordering Information:
SiR172ADP-T1-GE3 (Lead (Pb)-free and Halogen-free)
APPLICATIONS
• Notebook CPU Core
- High-Side Switch
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 300 µs)
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
I_AS
E_AS
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
T_A = 70 °C
Operating Junction and Storage Temperature Range
T_J, T_stg
Soldering Recommendations (Peak Temperature)^{d, e}
Limit
30
± 20
24^g
24^g
16.1^{b, c}
12.9^{b, c}
60
24^g
3.5^{b, c}
10
5
29.8
19
3.9^{b, c}
2.5^{b, c}
- 55 to 150
260
D
G
S
N-Channel MOSFET
Unit
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
27
Steady State
R_thJC
3.5
32
°C/W
4.2
Notes:
a. Base on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
Document Number: 62609
For technical questions, contact: [e-mail]
www.vishay.com
S12-2052-Rev.B, 27-Aug-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000