SIJ482DP Datasheet, PDF (1/10 Pages) Vishay Siliconix – N-Channel 80 V (D-S) MOSFET

New Product
N-Channel 80 V (D-S) MOSFET
SiJ482DP
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () (Max.)
0.0062 at V_GS = 10 V
80
0.0065 at V_GS = 7.5 V
0.0095 at V_GS = 4.5 V
I_D (A)^{a, g Q}g ^(Typ.)
60
24 nC
PowerPAK^® SO-8L Single
6.15 ^mm
5.13 _mm
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Capable of Operating with 5 V Gate Drive
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• DC/DC Primary Side Switch
D
• Synchronous Rectification
• High Current Switching
D
4
G
3
S
2
S
1
S
Ordering Information:
SiJ482DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
V_DS
Gate-Source Voltage
V_GS
T_C = 25 °C
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
T_A = 70 °C
Pulsed Drain Current (t = 300 µs)
I_DM
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L =0.1 mH
I_AS
E_AS
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_A = 70 °C
T_J, T_stg
Limit
80
± 20
60^g
60^g
21.1^{b, c}
16.9^{b, c}
100
60^g
4.5^{b, c}
30
45
69.4
44.4
5^{b, c}
3.2^{b, c}
- 55 to 150
260
G
S
N-Channel MOSFET
Unit
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
R_thJA
20
Steady State
R_thJC
1.3
25
°C/W
1.8
Notes:
a. Based on T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
g. Package limited.
Document Number: 63728
For technical support, please contact: [e-mail]
www.vishay.com
S12-0544-Rev. A, 12-Mar-12
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000