SIJ470DP Datasheet, PDF (1/10 Pages) Vishay Telefunken – N-Channel 100 V (D-S) MOSFET

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SiJ470DP
Vishay Siliconix
N-Channel 100 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
100
R_DS(on) () Max.
0.0091 at V_GS = 10 V
0.0100 at V_GS = 7.5 V
I_D (A)^a
58.8
54.6
PowerPAK^® SO-8L Single
Q_g (Typ.)
28.5 nC
6.15 ^mm
5.13 _mm
D
4
G
3
S
2
S
1
S
Ordering Information:
SiJ470DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• ThunderFET^® Technology Optimizes Balance
of R_DS(on), Q_g, Q_sw and Q_oss
• 100 % R_g and UIS Tested
• Material categorization: 
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Primary Side Switching
• Synchronous Rectification
• DC/AC Inverters
• LED Backlighting
• High Current Switching
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
T_C = 25 °C
58.8
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
47
17.4^{b, c}
Pulsed Drain Current (t = 100 μs)
T_A = 70 °C
13.9^{b, c}
A
I_DM
150
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
51.6
4.5^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
40
E_AS
80
mJ
T_C = 25 °C
56.8
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
36.3
5^{b, c}
W
T_A = 70 °C
3.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t  10 s
Steady State
Symbol
R_thJA
R_thJC
Typical
20
1.8
Maximum
25
2.2
Unit
°C/W
Notes
a. T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
S13-1672-Rev. A, 29-Jul-13
1
Document Number: 62883
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000