SIB456DK Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 100 V (D-S) MOSFET

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SiB456DK
Vishay Siliconix
N-Channel 100 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
100
R_DS(on) () MAX.
0.185 at V_GS = 10 V
0.310 at V_GS = 4.5 V
I_D (A)^a
6.3
4.9
Q_g (Typ.)
1.8 nC
PowerPAK SC-75-6L-Single
D
6
D
5
1.60 mm ^S
4
1
D
2
D
3
G
S
1.60 mm
Ordering Information:
SiB456DK-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATRUES
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^® SC-75
Package
- Small Footprint Area
- Low On-Resistance
• 100 % R_g and UIS Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• DC/DC Converters
• Full-Bridge Converters
• For Power Bricks and POL Power
Marking Code
D
Part # code
AJX
XXX
Lot Traceability
and Date code
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
100
V
V_GS
± 20
T_C = 25 °C
6.3
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
5
2.7^{b, c}
Pulsed Drain Current (t = 300 μs)
T_A = 70 °C
2.2^{b, c}
A
I_DM
7
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
6.3
2^{b, c}
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
2.4
E_AS
0.29
mJ
T_C = 25 °C
13
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
8.4
2.4^{b, c}
W
T_A = 70 °C
1.6^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
- 55 to 150
T_J, T_stg
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
R_thJA
41
Steady State
R_thJC
7.5
51
°C/W
9.5
Notes
a. T_C = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
S12-1133-Rev. A, 21-May-12
1
Document Number: 62715
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000