SIA440DJ Datasheet, PDF (1/9 Pages) Vishay Telefunken – N-Channel 40 V (D-S) MOSFET

SiA440DJ
Vishay Siliconix
N-Channel 40 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) () (Max.)
0.026 at V_GS = 10 V
0.028 at V_GS = 4.5 V
40
0.029 at V_GS = 3.7 V
0.035 at V_GS = 2.5 V
I_D (A)^a
12
12
12
12
PowerPAK SC-70-6L-Single
Q_g (Typ.)
6.9 nC
D
6
D
5
2.05 mm ^S
4
1
D
2
D
3
G
S
2.05 mm
Bottom View
Ordering Information:
SiA440DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Portable Devices such as Tablet PCs
D
and Mobile Computing
- DC/DC Converter
- Boost Converter
- Load Switch
G
- Power Management
- LED Backlighting
Marking Code
Part # code
AUX
XXX
Lot Traceability
and Date code
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
40
V
V_GS
± 12
T_C = 25 °C
12^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
12^a
8.6^{a,b, c}
Pulsed Drain Current (t = 100 µs)
T_A = 70 °C
6.9^{b, c}
A
I_DM
50
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
12^a
2.9^{b, c}
Single Avalanche Current
Single Avalanche Energy
L = 0.1 mH
I_AS
11
E_AS
6
mJ
T_C = 25 °C
19
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
12
3.5^{b, c}
W
T_A = 70 °C
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
R_thJA
28
Steady State
R_thJC
5.3
36
°C/W
6.5
Notes:
a. Based on package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
Document Number: 64138
For technical questions, contact:: [e-mail]
www.vishay.com
S13-1268-Rev. A, 27-May-13
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000