SI5904BDC Datasheet, PDF (1/16 Pages) Vishay Telefunken – N- and P-Channel 30 V (D-S) MOSFET

www.vishay.com
Si5504BDC
Vishay Siliconix
N- and P-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
N-Channel
P-Channel
V_DS (V)
30
-30
R_DS(on) ()
0.065 at V_GS = 10 V
0.100 at V_GS = 4.5 V
0.140 at V_GS = -10 V
0.235 at V_GS = -4.5 V
I_D (A)
4^a
4^a
-3.7
-2.8
Q_g (TYP.)
2 nC
2.2 nC
1206-8
ChipFET^® Dual
D₂
D₂
6
D₁
7
D₁
8
5
1 _3.0 ^mm
Top View
1
4
G₂
3
S₂
2
G₁
S₁
Bottom View
FEATURES
• TrenchFET^® Power MOSFETs
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• DC/DC for portable applications
• Load switch
D₁
S₂
G₂
G₁
Available
Marking Code: EF
Ordering Information:
Si5504BDC-T1-E3 (Lead (Pb)-free)
Si5504BDC-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
D₂
N-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
N-CHANNEL P-CHANNEL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current
Source Drain Current Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^d,e
T_C = 25 °C
T_C = 85 °C
T_A = 25 °C
T_A = 85 °C
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
T_C = 85 °C
T_A = 25 °C
T_A = 85 °C
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
30
-30
± 20
4^a
-3.7
3.8
-2.7
3.7 ^b,c
-2.5 ^b,c
2.6 ^b,c
-1.8 ^b,c
10
-10
2.5
-2.5
1.3 ^b,c
-1.3 ^b,c
3.12
3.1
2
2
1.5 ^b,c
1.5 ^b,c
0.8 ^b,c
0.8 ^b,c
-55 to 150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient ^b,f
Maximum Junction-to-Foot (Drain)
t5s
Steady State
SYMBOL
R_thJA
R_thJF
N-CHANNEL
TYP. MAX.
70
85
33
40
P-CHANNEL
TYP. MAX.
70
85
33
40
UNIT
°C/W
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See reliability manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequade bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 120 °C/W.
S13-2463-Rev. C, 02-Dec-13
1
Document Number: 74483
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000