73M2901CE Datasheet, PDF (1/22 Pages) Teridian Semiconductor Corporation – Single Chip Modem

Simplifying System Integration™
DS_2901CE_031
DESCRIPTION
The 73M2901CE low speed modem integrates a
data pump, controller, and analog front end in a
3.3 V device with a powerful "AT" command host
interface. The modem reduces external
component count/cost by incorporating many
features like parallel phone detect, Line-In-Use
and Ring detection in software without requiring
additional components.
The device is a "one chip fits all” solution for
applications including set-top boxes, point-of-sale
terminals, automatic teller machines, utility
meters, vending machines and smart card
readers.
Another distinctive feature of this device is pin
compatibility with Teridian’s flagship embedded
hard modems, the 73M2901CL, and the
73M1903 soft modem AFE. This offers
customers a cost effective method to design for
both hard or soft modem solutions in the same
system as a risk-free cost reduction path.
Complete support, modem reference designs
and error correction software are part of the
solution offered by Teridian. Our in-house
application engineering team is here to help
meet your international certification needs.
73M2901CE
V.22bis Single Chip Modem
DATA SHEET
April 2009
FEATURES
• True one chip solution for embedded systems
• As low as 9.5 mA operating with standby and
power down mode available
• Power supply operation from 3.6 V to 2.7 V
• Data modes and speeds:
V.22bis – 2400bps
V.22/Bell212 – 1200 bps
V.21/Bell103 – 300 bps
V.23 – 1200/75 bps (with PAVI turnaround)
Bell202 – 1200 bps
Bell202/V23 1200 bps FDX 4-wire operation
• V.22/Bell 212A/V.22bis synchronous modes
• International Call Progress support:
FCC part 68, CTR21, JATE, etc.
• DTMF generation and detection
• Worldwide Caller ID capability
U.S. Type I and II support
• EIA 777A compliant
• SIA-2000 compliant
• SMS messaging support
• On chip hybrid driver
• Blacklisting capability
• Line-In-Use and Parallel Pick-Up (911) detection
with voltage or low cost energy detection method
• Incoming ring energy detection through CID
path; no optocoupler circuitry required
• Manufacturing Self Test capability
• Backward compatible with 73M2901CL
• Packaging: 32 lead QFN, 32-pin TQFP
Rev. 3.3
© 2009 Teridian Semiconductor Corporation
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