U3666M Datasheet, PDF (7/8 Pages) TEMIC Semiconductors – Baseband Delay Line 64 us (Improved Version of U3665M)

Package Information
Package DIP16
Dimensions in mm
20.0 max
19.8 max
U3666M
7.82
7.42
Alternative
4.8 max
0.5 min
3.3
1.64
0.58
1.44
0.48
2.54
17.78
16
15
14
13
12
11
10
9
6.4 max
0.39 max
9.75
8.15
Package SO16
Dimensions in mm
1
2
3
4
5
6
7
8
technical drawings
according to DIN
specifications
96 11709
94 8875
TELEFUNKEN Semiconductors
7 (9)
Rev. A1, 10-Feb-97
Preliminary Information