U3661M Datasheet, PDF (7/9 Pages) TEMIC Semiconductors – Baseband Delay Line

Package Information
Package DIP16
Dimensions in mm
20.0 max
19.8 max
U3661M
7.82
7.42
Alternative
4.8 max
0.5 min
3.3
1.64
0.58
1.44
0.48
2.54
17.78
16
15
14
13
12
11
10
9
6.4 max
0.39 max
9.75
8.15
Package DIP16
Dimensions in mm
1
2
3
4
5
6
20.57
18.92
1.60
0.58
0.64
0.38
0.81
1.65
1.14
7
8
technical drawings
according to DIN
specifications
96 11709
0.76
0.13
3.81
3.05
0.89
0.38
3.81
3.05
7.87
7.37
6.60
6.10
0.38
0.20
2.79
9.40
2.29
7.62
technical drawings
according to DIN
specifications
96 11650
TELEFUNKEN Semiconductors
7 (9)
Rev. A1, 17-Jul-96
Preliminary Information