AVP2050 Datasheet, PDF (1/5 Pages) Teledyne Technologies Incorporated – HIGH POWER GaNPak C AMPLIFIER

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AVP2050
900 TO 2000 MHz, 63 WATTS
HIGH POWER GaNPak C AMPLIFIER
Typical Values
Broadband. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High Saturated Power, Psat. . . . . . . . . . . . . . . . . . . . . . . . .
High Third Order I.P. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Small Hermetic Package, Cougar GaNPakC
AVP2050
800-2100 MHz
63-100 Watts
+47 dBm
AVP2050
CougarGaNPak C
SPECIFICATIONS^*
Parameter
Typical
Frequency (Min.)
800-2100 MHz
Small Signal Gain (Min.)
Gain Flatness (Max.)
Noise Figure (Max.)
14.0 dB
±0.8 dB
3.2 dB
SWR (Max.)
Input/Output
Power Output (Min.)
@ 5 dB comp.
Reverse Isolation
DC Current (Max.)
Linear Oper.
P5dB Compress
2nd Stage: +28V
Switching Speed (Max.)
50% TTL to 90% Rise time
or 10% Fall Time^
<1.8:1
+48.0 dBm
+63.1W
35.0 dB
1700 mA
5500 mA
2 ms
Guaranteed
0 to 50 °C -55 to +85 °C
900-2000 MHz 900-2000 MHz
13.0 dB
±1.0 dB
3.5 dB†
12.0 dB
±1.0 dB
4.0 dB†
2.0:1
2.0:1
+47.5 dBm
+56.0 W
30.0 dB
1800 mA
6000 mA
4 ms
+47.2 dBm
+52.5 W
30.0 dB
2000 mA
6200 mA
5 ms
HEAT SINK WARNING:
This amplifier requires an adequate heat sink to prevent
damage. Maximum case temperature must not be
exceeded. The package is designed to provide ade-
quate heat transfer to proper aluminum heat sink.
* Measured in a 50-ohm system at +28V.
^ Faster switching speed option available upon request.
† Noise Figure 4.5 dB when Freq. ≤ 1 GHz.
INTERMODULATION PERFORMANCE
Typical @ 25 °C
Second Order Harmonic Intercept Point . . . . . . . . . . . . . .
Second Order Two Tone Intercept Point . . . . . . . . . . . . . . .
Third Order Two Tone Intercept Point . . . . . . . . . . . . . . . . .
AVP2050
+81 dBm
+75 dBm
+47 dBm
ABSOLUTE MAXIMUM RATINGS
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -62 to +125 °C
Maximum Case Temperature, +28V/+32V . . . . . . . . . . . . . . +90 °C/+75 °C
Maximum DC Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
+33 Volts
Maximum Continuous RF Input Power . . . . . . . . . . . . . . . . +40 dBm^{1, 2}
Maximum Short Term Input Power (1 Minute Max.) . . . . . .
+42 dBm
Maximum Peak Power (3 µsec Max.) . . . . . . . . . . . . . . . . . .
+44 dBm
Burn-in Temperature, +28V . . . . . . . . . . . . . . . . . . . . . . . . .
+85 °C
Thermal Resistance³ (θjc) . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5 °C/Watt
Junction Temperature Rise Above Case (Tjc), +28V . . . . .
+98 °C
1 _{If no load or a short on output; decrease input power by +10 dBm.}
2 _{Maximum gain compress is 6 dB.}
3 _{Thermal resistance is based on total power dissipation.}
The AVP2050 amplifier provides nominal output
power of 50-63 Watts. The amplifier uses control
circuitry to ensure safe startup and automatic
thermal shutdown and recovery. The amplifiers have
an external pin for TTL on/off control. On/Off Low or
High can be specified; standard is Off/Low.
Heat sinking is required to keep the case
temperatures within a safe operating range. A thin
layer of thermal grease or HiTherm (for example the
HT-2500 series) helps provide a low resistance
thermal path between the case and the mounting
surface. The mounting surface should be metal with
heat conduction of aluminum or better. Heat sink
size depends on whether fan-driven air cooling is
used, or if only convection is used.
Maximum Tj of amplifier is 200°C.
LOGIC TABLE
TTL
HIGH
LOW
STATE
ON
OFF
DIMENSIONS ARE IN INCHES [MILLIMETERS]
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