CPF-A Datasheet, PDF (2/6 Pages) TE Connectivity Ltd – Automotive Grade Thin Film Chip Resistor

Automotive Grade Thin Film Chip Resistor
Derating Curve _{Derating Curve}
100
80
60
40
20
0
0
20
40 60 80 100 120 140 160 180
Ambient Temperature(℃)
Construction and dimensions
L
D1
W
T
D2




 ^{} 
 Alumina Substrate
 Edge Electrode (NiCr)  Resistor Layer (NiCr)
 Bottom Electrode (Ag)
 Barrier Layer (Ni)
 Overcoat (Epoxy)
 Top Electrode ( Ag-Pd or Cu)  External Electrode (Sn)  Marking
Size
L
W
T
D1
0402
0603
0805
1206
2010
2512
1.00±0.05
1.55±0.10
2.00±0.15
3.05±0.15
4.90±0.15
6.30±0.15
0.50±0.05
0.80±0.10
1.25±0.15
1.55±0.15
2.40±0.15
3.10±0.15
0.30±0.05
0.45±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.55±0.10
0.20±0.10
0.30±0.20
0.30±0.20
0.42±0.20
0.60±0.30
0.60±0.30
D2
0.20±0.10
0.30±0.20
0.40±0.20
0.35±0.25
0.50±0.25
0.50±0.25
Weight
(g)
(1000pcs)
0.54
1.83
4.71
9.02
23.61
38.06
1773200-1 CIS WR 02/2015
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help