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LCT Datasheet, PDF (1/6 Pages) TE Connectivity Ltd – Low Profile Filtered Modular Jacks | |||
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N Series
Corcom Product Guide
Low Proï¬le Filtered Modular Jacks
Catalog: 1654001
Issue Date: 06.2011
UL Recognized
CSA Certiï¬ed
Shield 3
RJ11
Shield 4
RJ45
N Series
⢠Low proï¬le SignalSentry ï¬ltered jack
⢠Available with sleeve or block inductors
⢠Available unshielded or shielded with board
grounded shield or spring ï¬ngered panel
ground interface
Typical Impedance in Ohms
100
90
80
70
60
50
40
30
20
10
0
1
25
100
200 500 1000
Frequency in MHz
Ferrite block
Ferrite sleeve
Speciï¬cations
Contacts:
Material:
Phosphor Bronze
Plating:
50 microinches gold
Barrier underplating:
100 microinches nickel
Resistance:
Initial:
20 mï max.
After 500 mating cycles:
30 mï max.
Ferrites:
Type:
Sleeves:
Block:
High resistivity, nickel zinc ceramic
Single-aperture cylinders
Multi-aperture rectangular prism
Shield Material:
Tin-plated copper alloy
Housing Material:
Black glass-filled polyamide
(STANYL TE250F3)
Dielectric Withstanding Voltage:
Line to Line and Line to Ground:
1000 VAC for
60 seconds
Printed Circuit Board Retention:
Before soldering:
After soldering:
1 lb. minimum
20 lb. minimum
Available Part Numbers
RJ11-6N-B
RJ11-6N3-B
RJ11-6N4-B
RJ45-8N-B
RJ45-8N-S
RJ45-8N3-B
RJ45-8N3-S
RJ45-8N4-B
RJ45-8N4-S
Unshielded
Ferrite Block
Model dimensions and PC board layout on pages 255-259
6
Dimensions are in inches and millimeters unless otherwise speciï¬ed. Values in italics
are metric equivalents. Dimensions are shown for reference purposes only.
Speciï¬cations subject to change.
251
For email, phone or live chat, please go to
te.com/help
corcom.com
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