YNA15B1J0G105MT000N Datasheet, PDF (3/7 Pages) TDK Electronics – Noise Absorber

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EMC Components
Overview of YNA Series
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Preheating
Soldering
Slow cooling
(Natural cooling)
260˚C max.
0
60 seconds or more
HAND SOLDERING
300
10s max.
PRECAUTIONS FOR USE
Before soldering, be sure to preheat components. The 'T pre-
heating temperature must be 150°C max. with attention paid to
thermal shock.
Natural cooling of components in the air is recommended. On
the other hand, when dipping them in a solvent for purposes,
such as cleaning, make sure that the temperature difference
('T) is 100°
When performing hand soldering for circuit modification, apply
the soldering iron to the copper foil area of the printed circuit
board for 3 seconds or less. The temperature of the iron tip
should not exceed 300°C.
Use a wrist band to discharge static electricity in your body
through the grounding wire.
When incorporating the printed circuit board on which this prod-
uct is mounted into a frame, etc., do not apply stress to the prod-
uct through local bending of the board by tightening of screws,
etc.
0
Preheating
Make as short as possilble (within three seconds)
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
20151028 / emc_esr_yna_en.fm