YFF21PC1A105M Datasheet, PDF (3/7 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors Commercial Grade Three-terminal Feed-through Type

(3/7)
Overview of CKD Series
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Preheating
Soldering
Slow cooling
(Natural cooling)
260˚C max.
0
60 seconds or more
HAND SOLDERING
300
10s max.
PRECAUTIONS FOR USE
Before soldering, be sure to preheat components. The T pre-
heating temperature must be 150°C max. with attention paid to
thermal shock.
Natural cooling of components in the air is recommended. On
the other hand, when dipping them in a solvent for purposes,
such as cleaning, make sure that the temperature difference
(T) is 100°C.
When performing hand soldering for circuit modification, apply
the soldering iron to the copper foil area of the printed circuit
board for 3 seconds or less. The temperature of the iron tip
should not exceed 300°C.
Use a wrist band to discharge static electricity in your body
through the grounding wire.
When incorporating the printed circuit board on which this prod-
uct is mounted into a frame, etc., do not apply stress to the prod-
uct through local bending of the board by tightening of screws,
etc.
0
Preheating
Make as short as possilble (within three seconds)
All specifications are subject to change without notice.
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