NTCG06 Datasheet, PDF (3/14 Pages) TDK Electronics – NTC Thermistors SMD NTCG series

(2/13)
SHAPES AND DIMENSIONS
L
STRUCTURAL DIAGRAM
Inner electrode
Thermistor body
(Palladium) (Metal oxide sintering ceramics)
B
Type
0603
1005
1608
2012
L
0.6±0.03
1±0.05
1.6±0.1
2±0.2
Electrode material
Internal:Pd
External:Ag/Ni/Sn
W
0.3±0.03
0.5±0.05
0.8±0.1
1.25±0.2
T
0.3±0.03
0.5±0.05
0.8±0.1
0.7±0.2
Dimensions in mm
B
0.1 min.
0.1 min.
0.2 min.
0.2 min.
RECOMMENDED PC BOARD PATTERN
b
a
b
Type
0603
1005
1608
2012
a
0.25 to 0.35
0.3 to 0.5
0.6 to 0.8
0.9 to 1.2
b
0.2 to 0.3
0.35 to 0.45
0.6 to 0.8
0.7 to 0.9
Dimensions in mm
c
0.25 to 0.35
0.4 to 0.6
0.6 to 0.8
0.9 to 1.2
Sn plating
Ag termination
underlayer
Ni plating
RECOMMENDED REFLOW SOLDERING CONDITIONS
260˚C max.
250˚C
220˚C
10s max.
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
60s max.
• All specifications are subject to change without notice.
010-01 / 20090528 / eb221_ntcg.fm