MMZ0402 Datasheet, PDF (25/29 Pages) TDK Electronics – Chip Beads For signal line MMZ series

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Chip Beads
For Signal Line
Conformity to RoHS Directive
MMZ Series MMZ0603-E
FEATURES
• This is a multilayered chip bead product with dimensions of
L0.6W0.3T0.3mm.
• Compared with the existing MMZ0603 type, this new product
has broad-band impedance values for higher frequency ranges.
• The product is magnetically shielded, allowing high density
mounting.
• We refined the rules for internal conductor design to reduce
floating capacity between conductors, which in turn has
contributed to a dramatic improvement in high frequency
characteristics. We have also been able to expand and reinforce
the EMI suppression in the GHz range.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio
players, various modules, DSCs, portable game machines, etc.
PRODUCT IDENTIFICATION
MMZ 0603 S 102 E T
(1) (2) (3) (4) (5) (6) (7)
(1) Series name
(2) Dimensions LW
(3) Type name
(4) Impedance
102:1000 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
0.6±0.03
0.1min.
0.25 0.30 0.25
Weight: 0.3mg
Dimensions in mm
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C(After mount)
PACKAGING STYLE AND QUANTITIES
Packaging style
Quantity
Taping
15000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
10s max.
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Soldering
30 to 60s
Time(s)
ELECTRICAL CHARACTERISTICS
Part No.
MMZ0603S601E
MMZ0603S102E
Impedance( )^
[100MHz] [1GHz]
600±25% 1000±40%
1000±25% 1800±40%
 _{Test equipment: E4991A or equivalent}
Test tool: 16197 or equivalent
Test temperature: 25±10°C
DC resistance Rated current
( )max.
(mA)max.
1.60
150
2.60
125
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
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