C0402C0G1C270KT Datasheet, PDF (20/34 Pages) TDK Electronics – MULTILAYER CERAMIC CHIP CAPACITORS

No.
Process
Condition
5
Soldering
5-1. Flux selection
Although highly-activated flux gives better solderability, substances which increase
activity may also degrade the insulation of the chip capacitors. To avoid such
degradation, it is recommended following.
1) It is recommended to use a mildly activated rosin flux (less than 0.1wt% chlorine).
Strong flux is not recommended.
2) Excessive flux must be avoided. Please provide proper amount of flux.
3) When water-soluble flux is used, enough washing is necessary.
5-2. Recommended soldering profile by various methods
Wave soldering
Preheating
Soldering
Natural cooling
Reflow soldering
Preheating
Soldering
Natural cooling
Peak
Temp
Peak
Temp
△T
∆T
0
Over 60 sec.
Over 60 sec.
Peak Temp time
0
Over 60 sec.
Peak Temp time
Manual soldering
(Solder iron)
300
APPLICATION
As for C1608 (CC0603), C2012 (CC0805)
and C3216 (CC1206), applied to wave
soldering and reflow soldering.
∆T
As for C0402 (CC01005), C0603 (CC0201),
C1005 (CC0402), C3225 (CC1210), C4532
(CC1812), C5750 (CC2220), applied only to
Preheating
reflow soldering.
0
3sec. (As short as possible)
5-3. Recommended soldering peak temp and peak temp duration
Temp./Duration
Wave soldering
Reflow soldering
Solder
Sn-Pb Solder
Peak temp(°C) Duration(sec.) Peak temp(°C) Duration(sec.)
250 max.
3 max.
230 max.
20 max.
Lead Free Solder 260 max.
5 max.
260 max.
10 max.
Recommended solder compositions
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
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