MMZ2012R150A Datasheet, PDF (2/4 Pages) TDK Electronics – Chip Beads(SMD) For Signal Line

(2/4)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
2±0.2
0.5±0.3
0.8 1 0.8
Weight: 8mg
Dimensions in mm
TEMPERATURE RANGES
Operating/storage
–55 to +125°C
PACKAGING STYLE AND QUANTITIES
Packaging style
Quantity
Taping
4000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
250 to 260˚C
230˚C
10s max.
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
ELECTRICAL CHARACTERISTICS
Part No.
MMZ2012R150A
MMZ2012R300A
MMZ2012R600A
MMZ2012R121A
MMZ2012R301A
MMZ2012R601A
MMZ2012R102A
MMZ2012S400A
MMZ2012S800A
MMZ2012S121A
MMZ2012S181A
MMZ2012S301A
MMZ2012S601A
MMZ2012S102A
MMZ2012Y150B
MMZ2012Y300B
MMZ2012Y600B
MMZ2012Y121B
MMZ2012Y301B
MMZ2012Y601B
MMZ2012Y102B
MMZ2012Y152B
MMZ2012Y202B
MMZ2012D800B
MMZ2012D121B
MMZ2012D301B
Impedance
(Ω)±25%
[100MHz]^∗
15
30
60
120
300
600
1000
40
80
120
180
300
600
1000
15
30
60
120
300
600
1000
1500
2000
80
120
300
DC resistance
(Ω)max.
0.05
0.05
0.1
0.12
0.15
0.2
0.3
0.1
0.1
0.15
0.15
0.2
0.3
0.35
0.05
0.05
0.1
0.12
0.15
0.2
0.3
0.4
0.5
0.3
0.3
0.5
∗ _{Test equipment: E4991A or equivalent}
Test tool: 16192A or equivalent
Test temperature: 25±10°C
Rated current
(mA)max.
1500
1500
1000
800
600
500
500
1000
800
800
600
600
500
500
1500
1500
1000
800
600
500
500
500
400
500
500
400
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ2012R150A
MMZ2012R300A
120
120
100
100
80
80
60
60
40
40
Z
20
Z
20
R
RX
X
0
1
10
100
1000 10000
0
1
10
100
1000
Frequency(MHz)
Frequency(MHz)
MMZ2012R121A
500
MMZ2012R301A
500
400
400
300
200
100
01
Z
R
X
10
100
1000
Frequency(MHz)
10000
300
200
100
01
Z
R
X
10
100 1000
Frequency(MHz)
MMZ2012R600A
120
100
80
60
Z
40
R
20
X
10000
0
1
10
100
1000
Frequency(MHz)
MMZ2012R601A
10000
1000
900
800
700
600
500
400
300
200
100
01
Z
R
X
10
100 1000
Frequency(MHz)
10000
10000
• All specifications are subject to change without notice.
007-02 / 20090921 / e9412_mmz2012.fm