C0603C0G1E080B030BG Datasheet, PDF (14/15 Pages) TDK Electronics – MULTILAYER CERAMIC CHIP CAPACITORS

Packaging
Information
¬ Carrier Tape Configuration
 Bulk
160mm min.
Chips
C0603 Series – High Q Capacitors
 Bulk
160mm min
Drawing direction
Leader
400mm min
¬ Peel Back Force (Top Tape)
Carrier tape
Direction & angle of pull
Top cover tape
0.05 – 0.7 N
0~15q
Bottom cover tape (Paper carrier tape)
Direction of pull force
¬ Chip Quantity Per Reel and Structure of Reel
Paper Carrier Tape & Reel
Top cover tape
Pitch hole
Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
The missing of components shall be less than
0.1%
Components shall not stick to the cover tape.
The cover tape shall not protrude beyond the
edges of the carrier tape and shall not cover the
sprocket holes.
Bottom cover tape
Paper carrier tape
(Bottom cover tape is not always applied)
Case Code
JIS
EIA
C0603
CC0201
Chip
Thickness
(mm)
0.30
Taping
Material
Paper
Chip quantity (pcs.)
ijPP´UHHO
15,000
* This series is available through the distribution channel only. Please see www.tdk.com/distributor.php for a list of authorized distributors.
TDK MLCC US Catalog
Page 160
Version B11