MLG1608 Datasheet, PDF (1/2 Pages) TDK Electronics – For High Frequency SMD

Inductors
For High Frequency
SMD
(1/2)
001-01 / 20021008 / e521_mlg1608.fm
MLG Series MLG1608 Type
FEATURES
• Supports operating frequency bands of up to 10GHz with nomi-
nal inductance values from 1 to 100nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
APPLICATIONS
For high-frequency applications including mobile phones, portable
phones, cordless phones, pagers and personal handy-phone sys-
tems (PHS).
SHAPES AND DIMENSIONS
1.6±0.15
PRODUCT IDENTIFICATION
MLG 1608 B 2N2 S T
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
1608
(3) Material code
(4) Inductance value
2N2
12N
39N
(5) Inductance tolerance
S
D
J
1.6×0.8mm
2.2nH
12nH
39nH
±0.3nH
±0.5nH
±5%
0.3±0.2
(6) Packaging style
T
Taping (reel)
Weight: 4mg
RECOMMENDED PC BOARD PATTERN
0.7
0.7
0.7
Dimensions in mm
SPECIFICATIONS
Operating temperature range
Storage temperature range
–25 to +85°C
–40 to +85°C [Unit of products]
RECOMMENDED REFLOW SOLDERING CONDITIONS
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
4000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
260°C. Soldering time should not exceed 3 seconds.
230˚C
200˚C
150˚C
10s max.
Natural
cooling
Preheating 60 to 120s min. 40s max.
Time(s)
• All specifications are subject to change without notice.