CGA9N2X7R1E156M230KA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
CGA9N2X7R1E156M230KA
TDK item description CGA9N2X7R1E156MT****
Applications
Automotive Grade
Feature
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
CGA9(5750) [EIA 2220]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
5.70mm ±0.40mm
5.00mm ±0.40mm
2.30mm ±0.20mm
0.20mm Min.
4.10mm to 4.80mm
1.20mm to 1.40mm
4.00mm to 5.00mm
Electrical Characteristics
15μF ±20%
25VDC
X7R(±15%)
3%
33MΩ
Other
Reflow
Yes
Blister (Plastic)Taping [180mm Reel]
500pcs
1 of 3
Creation Date : July 04, 2017 (GMT)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.