CGA8N3X7R1C226M230KB_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
CGA8N3X7R1C226M230KB
TDK item description CGA8N3X7R1C226MT****
Applications
Automotive Grade
Feature
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
CGA8(4532) [EIA 1812]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
4.50mm ±0.40mm
3.20mm ±0.40mm
2.30mm ±0.20mm
0.20mm Min.
3.10mm to 3.70mm
1.20mm to 1.40mm
2.40mm to 3.20mm
Electrical Characteristics
22μF ±20%
16VDC
X7R(±15%)
7.5%
4MΩ
Other
Reflow
Yes
Blister (Plastic)Taping [180mm Reel]
500pcs
1 of 3
Creation Date : July 04, 2017 (GMT)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.