CGA6P1X7R1C226M250AC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
CGA6P1X7R1C226M250AC
TDK item description CGA6P1X7R1C226MT****
Applications
Automotive Grade
Feature
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
CGA6(3225) [EIA 1210]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.40mm
2.50mm ±0.30mm
2.50mm ±0.30mm
0.20mm Min.
2.00mm to 2.40mm
1.00mm to 1.20mm
1.90mm to 2.50mm
Electrical Characteristics
22μF ±20%
16VDC
X7R(±15%)
5%
4MΩ
Other
Reflow
Yes
Blister (Plastic)Taping [180mm Reel]
1000pcs
1 of 3
Creation Date : July 03, 2017 (GMT)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.