CGA5L3X5R1H225K160AB_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
CGA5L3X5R1H225K160AB
1 of 3
Creation Date : June 30, 2017 (GMT)
TDK item description CGA5L3X5R1H225KT****
Applications
Automotive Grade
Feature
Series
General General (Up to 50V)
AEC-Q200 AEC-Q200
CGA5(3216) [EIA 1206]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm +0.30,-0.10mm
1.60mm +0.30,-0.10mm
1.60mm +0.30,-0.10mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
2.2μF ±10%
50VDC
X5R(±15%)
5%
227MΩ
Other
Wave (Flow)
Reflow
Yes
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.