CGA5L1X7S1A156M160AC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
CGA5L1X7S1A156M160AC
1 of 3
Creation Date : June 30, 2017 (GMT)
TDK item description CGA5L1X7S1A156MT****
Applications
Automotive Grade
Feature
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
CGA5(3216) [EIA 1206]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm +0.30,-0.10mm
1.60mm +0.30,-0.10mm
1.60mm +0.30,-0.10mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
15μF ±20%
10VDC
X7S(±22%)
7.5%
6MΩ
Other
Wave (Flow)
Reflow
Yes
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.