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CGA4J1X5R1C106M125AC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
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Multilayer Ceramic Chip Capacitors
CGA4J1X5R1C106M125AC
1 of 3
Creation Date : June 28, 2017 (GMT)
TDK item description CGA4J1X5R1C106MT****
Applications
Automotive Grade
Feature
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
CGA4(2012) [EIA 0805]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
2.00mm ±0.20mm
1.25mm ±0.20mm
1.25mm ±0.20mm
0.20mm Min.
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reï¬ow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
Electrical Characteristics
10μF ±20%
16VDC
X5R(±15%)
10%
10MΩ
Other
Wave (Flow)
Reï¬ow
Yes
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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