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CGA3E2C0G1H3R3C080AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
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Multilayer Ceramic Chip Capacitors
CGA3E2C0G1H3R3C080AA
1 of 3
Creation Date : June 22, 2017 (GMT)
TDK item description CGA3E2C0G1H3R3CT****
Applications
Automotive Grade
Feature
General General (Up to 50V)
AEC-Q200 AEC-Q200
Series
CGA3(1608) [EIA 0603]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
1.60mm ±0.10mm
0.80mm ±0.10mm
0.80mm ±0.10mm
0.20mm Min.
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reï¬ow Soldering)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reï¬ow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reï¬ow Soldering)
Electrical Characteristics
3.3pF ±0.25pF
50VDC
C0G(0±30ppm/°C)
466
10000MΩ
Other
Wave (Flow)
Reï¬ow
Yes
Punched (Paper)Taping [180mm Reel]
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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