C5750X5R1H106K230KA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C5750X5R1H106K230KA
1 of 3
Creation Date : June 05, 2017 (GMT)
TDK item description C5750X5R1H106KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C5750 [EIA 2220]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
5.70mm ±0.40mm
5.00mm ±0.40mm
2.30mm ±0.20mm
0.20mm Min.
4.10mm to 4.80mm
1.20mm to 1.40mm
4.00mm to 5.00mm
Electrical Characteristics
10μF ±10%
50VDC
X5R(±15%)
5%
50MΩ
Other
Reflow
No
Blister (Plastic)Taping [180mm Reel]
500pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.