C3225X6S1H475M250AB_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C3225X6S1H475M250AB
1 of 3
Creation Date : June 02, 2017 (GMT)
TDK item description C3225X6S1H475MT****
Applications
Commercial Grade
Feature
General General (Up to 50V)
Series
C3225 [EIA 1210]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.40mm
2.50mm ±0.30mm
2.50mm ±0.30mm
0.20mm Min.
2.00mm to 2.40mm
1.00mm to 1.20mm
1.90mm to 2.50mm
Electrical Characteristics
4.7μF ±20%
50VDC
X6S(±22%)
5%
106MΩ
Other
Reflow
No
Blister (Plastic)Taping [180mm Reel]
1000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.