C3225CH1H333K160AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C3225CH1H333K160AA
1 of 3
Creation Date : June 01, 2017 (GMT)
TDK item description C3225CH1H333KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C3225 [EIA 1210]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.40mm
2.50mm ±0.30mm
1.60mm ±0.20mm
0.20mm Min.
2.00mm to 2.40mm
1.00mm to 1.20mm
1.90mm to 2.50mm
Electrical Characteristics
33nF ±10%
50VDC
CH(0±60ppm/°C)
1000
10000MΩ
Other
Reflow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.