C3225CH1H104J250AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C3225CH1H104J250AA
1 of 3
Creation Date : June 01, 2017 (GMT)
TDK item description C3225CH1H104JT****
Applications
Commercial Grade
Feature
General General (Up to 50V)
Series
C3225 [EIA 1210]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.40mm
2.50mm ±0.30mm
2.50mm ±0.30mm
0.20mm Min.
2.00mm to 2.40mm
1.00mm to 1.20mm
1.90mm to 2.50mm
Electrical Characteristics
100nF ±5%
50VDC
CH(0±60ppm/°C)
1000
5000MΩ
Other
Reflow
No
Blister (Plastic)Taping [180mm Reel]
1000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.