C3225C0G3A183J250AC Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C3225C0G3A183J250AC
1 of 3
Creation Date : January 17, 2017 (GMT)
TDK item description C3225C0G3A183JT****
Applications
Commercial Grade
Please refer to Part No. CGA6P1C0G3A183J250AC for Automotive use.
Feature
High High Voltage (1000V and over)
Series
C3225 [EIA 1210]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Recommended Slit Pattern (SD)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.40mm
2.50mm ±0.30mm
2.50mm ±0.30mm
0.20mm Min.
2.00mm to 2.40mm
1.00mm to 1.20mm
1.90mm to 2.50mm
Electrical Characteristics
18nF ±5%
1kVDC
C0G(0±30ppm/°C)
1000
10000MΩ
Other
Reflow
No
Blister (Plastic)Taping [180mm Reel]
1000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.