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C3216X7R1H475M160AC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
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Multilayer Ceramic Chip Capacitors
C3216X7R1H475M160AC
1 of 3
Creation Date : May 29, 2017 (GMT)
TDK item description C3216X7R1H475MT****
Applications
Commercial Grade
Feature
General General (Up to 50V)
Series
C3216 [EIA 1206]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.20mm
1.60mm ±0.20mm
1.60mm ±0.20mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reï¬ow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reï¬ow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reï¬ow Soldering)
Electrical Characteristics
4.7μF ±20%
50VDC
X7R(±15%)
5%
106MΩ
Other
Wave (Flow)
Reï¬ow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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