C3216X7R1H335M160AC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C3216X7R1H335M160AC
1 of 3
Creation Date : May 29, 2017 (GMT)
TDK item description C3216X7R1H335MT****
Applications
Commercial Grade
Feature
General General (Up to 50V)
Series
C3216 [EIA 1206]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.20mm
1.60mm ±0.20mm
1.60mm ±0.20mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
3.3μF ±20%
50VDC
X7R(±15%)
5%
151MΩ
Other
Wave (Flow)
Reflow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.