C3216X7R1H105K160AB_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C3216X7R1H105K160AB
1 of 3
Creation Date : May 29, 2017 (GMT)
TDK item description C3216X7R1H105KT****
Applications
Commercial Grade
Please refer to Part No. CGA5L3X7R1H105K160AB for Automotive use.
Feature
General General (Up to 50V)
Series
C3216 [EIA 1206]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.20mm
1.60mm ±0.20mm
1.60mm ±0.20mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
1μF ±10%
50VDC
X7R(±15%)
5%
500MΩ
Other
Wave (Flow)
Reflow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.