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C3216CH1H562K060AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
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Multilayer Ceramic Chip Capacitors
C3216CH1H562K060AA
1 of 3
Creation Date : May 22, 2017 (GMT)
TDK item description C3216CH1H562KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C3216 [EIA 1206]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.20mm
1.60mm ±0.20mm
0.60mm ±0.15mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reï¬ow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reï¬ow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reï¬ow Soldering)
Electrical Characteristics
5.6nF ±10%
50VDC
CH(0±60ppm/°C)
1000
10000MΩ
Other
Wave (Flow)
Reï¬ow
No
Punched (Paper)Taping [180mm Reel]
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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