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C3216C0G2E332K085AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
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Multilayer Ceramic Chip Capacitors
C3216C0G2E332K085AA
1 of 3
Creation Date : February 28, 2017
(GMT)
TDK item description C3216C0G2E332KT****
Applications
Commercial Grade
Feature
Series
Mid Mid Voltage (100 to 630V)
C3216 [EIA 1206]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.20mm
1.60mm ±0.20mm
0.85mm ±0.15mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reï¬ow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reï¬ow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reï¬ow Soldering)
Electrical Characteristics
3.3nF ±10%
250VDC
C0G(0±30ppm/°C)
1000
10000MΩ
Other
Wave (Flow)
Reï¬ow
No
Punched (Paper)Taping [180mm Reel]
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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