C3216C0G1H223J060AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C3216C0G1H223J060AA
1 of 3
Creation Date : May 22, 2017 (GMT)
TDK item description C3216C0G1H223JT****
Applications
Commercial Grade
Please refer to Part No. CGA5C2C0G1H223J060AA for Automotive use.
Feature
General General (Up to 50V)
Series
C3216 [EIA 1206]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
3.20mm ±0.20mm
1.60mm ±0.20mm
0.60mm ±0.15mm
0.20mm Min.
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
22nF ±5%
50VDC
C0G(0±30ppm/°C)
1000
10000MΩ
Other
Wave (Flow)
Reflow
No
Punched (Paper)Taping [180mm Reel]
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.