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C2012X7R1V335K125AC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
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Multilayer Ceramic Chip Capacitors
C2012X7R1V335K125AC
1 of 3
Creation Date : May 22, 2017 (GMT)
TDK item description C2012X7R1V335KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C2012 [EIA 0805]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
2.00mm ±0.20mm
1.25mm ±0.20mm
1.25mm ±0.20mm
0.20mm Min.
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reï¬ow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
Electrical Characteristics
3.3μF ±10%
35VDC
X7R(±15%)
7.5%
151MΩ
Other
Wave (Flow)
Reï¬ow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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