|
C2012X5R1H105M125AB_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
|
Multilayer Ceramic Chip Capacitors
C2012X5R1H105M125AB
1 of 3
Creation Date : May 16, 2017 (GMT)
TDK item description C2012X5R1H105MT****
Applications
Commercial Grade
Please refer to Part No. CGA4J3X5R1H105M125AB for Automotive use.
Feature
General General (Up to 50V)
Series
C2012 [EIA 0805]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
2.00mm ±0.20mm
1.25mm ±0.20mm
1.25mm ±0.20mm
0.20mm Min.
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reï¬ow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
Electrical Characteristics
1μF ±20%
50VDC
X5R(±15%)
5%
500MΩ
Other
Wave (Flow)
Reï¬ow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
|
▷ |