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C2012JB2E103K125AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors | |||
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Multilayer Ceramic Chip Capacitors
C2012JB2E103K125AA
1 of 3
Creation Date : February 24, 2017
(GMT)
TDK item description C2012JB2E103KT****
Applications
Commercial Grade
Feature
Mid Mid Voltage (100 to 630V)
Series
C2012 [EIA 0805]
Status
Production
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
2.00mm ±0.20mm
1.25mm ±0.20mm
1.25mm ±0.20mm
0.20mm Min.
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reï¬ow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reï¬ow Soldering)
Electrical Characteristics
10nF ±10%
250VDC
JB(±10%)
3%
10000MΩ
Other
Wave (Flow)
Reï¬ow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All speciï¬cations are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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