C2012JB2A222M085AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C2012JB2A222M085AA
1 of 3
Creation Date : February 24, 2017
(GMT)
TDK item description C2012JB2A222MT****
Applications
Commercial Grade
Feature
Mid Mid Voltage (100 to 630V)
Series
C2012 [EIA 0805]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
2.00mm ±0.20mm
1.25mm ±0.20mm
0.85mm ±0.15mm
0.20mm Min.
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
2.2nF ±20%
100VDC
JB(±10%)
3%
10000MΩ
Other
Wave (Flow)
Reflow
No
Punched (Paper)Taping [180mm Reel]
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.