C2012JB1H224K125AA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C2012JB1H224K125AA
1 of 3
Creation Date : May 15, 2017 (GMT)
TDK item description C2012JB1H224KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C2012 [EIA 0805]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
2.00mm ±0.20mm
1.25mm ±0.20mm
1.25mm ±0.20mm
0.20mm Min.
0.50mm Min.
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
220nF ±10%
50VDC
JB(±10%)
2.5%
2272MΩ
Other
Wave (Flow)
Reflow
No
Blister (Plastic)Taping [180mm Reel]
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.