C1608X7R1V154M080AB_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C1608X7R1V154M080AB
1 of 3
Creation Date : May 08, 2017 (GMT)
TDK item description C1608X7R1V154MT****
Applications
Commercial Grade
Please refer to Part No. CGA3E3X7R1V154M080AB for Automotive use.
Feature
General General (Up to 50V)
Series
C1608 [EIA 0603]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
1.60mm ±0.10mm
0.80mm ±0.10mm
0.80mm ±0.10mm
0.20mm Min.
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
150nF ±20%
35VDC
X7R(±15%)
5%
3333MΩ
Other
Wave (Flow)
Reflow
No
Punched (Paper)Taping [180mm Reel]
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.