C1608X6S1A105K080AC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C1608X6S1A105K080AC
1 of 3
Creation Date : May 02, 2017 (GMT)
TDK item description C1608X6S1A105KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C1608 [EIA 0603]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
1.60mm +0.15,-0.10mm
0.80mm +0.15,-0.10mm
0.80mm +0.15,-0.10mm
0.20mm Min.
0.30mm Min.
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Electrical Characteristics
1μF ±10%
10VDC
X6S(±22%)
5%
100MΩ
Other
Wave (Flow)
Reflow
No
Punched (Paper)Taping [180mm Reel]
4000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.