C1005X6S1C334K050BC_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C1005X6S1C334K050BC
1 of 3
Creation Date : April 17, 2017 (GMT)
TDK item description C1005X6S1C334KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C1005 [EIA 0402]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
1.00mm ±0.05mm
0.50mm ±0.05mm
0.50mm ±0.05mm
0.10mm Min.
0.30mm Min.
0.30mm to 0.50mm
0.35mm to 0.45mm
0.40mm to 0.60mm
Electrical Characteristics
330nF ±10%
16VDC
X6S(±22%)
10%
303MΩ
Other
Reflow
No
Punched (Paper)Taping [180mm Reel]
10000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.