C0603CH1H330K030BA_17 Datasheet, PDF (1/3 Pages) TDK Electronics – Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors
C0603CH1H330K030BA
1 of 3
Creation Date : March 27, 2017 (GMT)
TDK item description C0603CH1H330KT****
Applications
Commercial Grade
Feature
Series
General General (Up to 50V)
C0603 [EIA 0201]
Status
Production (Not Recommended for New Design)
Length(L)
Width(W)
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
Capacitance
Rated Voltage
Temperature Characteristic
Q (Min.)
Insulation Resistance (Min.)
Soldering Method
AEC-Q200
Packing
Package Quantity
Size
0.60mm ±0.03mm
0.30mm ±0.03mm
0.30mm ±0.03mm
0.10mm Min.
0.20mm Min.
0.25mm to 0.35mm
0.20mm to 0.30mm
0.25mm to 0.35mm
Electrical Characteristics
33pF ±10%
50VDC
CH(0±60ppm/°C)
1000
10000MΩ
Other
Reflow
No
Punched (Paper)Taping [180mm Reel]
15000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.