73M2901 Datasheet, PDF (1/17 Pages) TDK Electronics – Advanced Single Chip Modem

73M2901/3.3V
Advanced Single
Chip Modem
December 2000
DESCRIPTION
FEATURES
The 73M2901/3.3V is a single-chip modem that
combines all the controller (DTE) and data pump
functions necessary to implement an intelligent
V.22bis data modem. This device is based on TDK
Semiconductor’s implementation of the industry
standard 8032 microcontroller core with a proprietary
multiply and accumulate (MAC) coprocessor; Sigma-
Delta A/D and D/A converters; and an analog front
end. The ROM and RAM necessary to operate the
modem are contained on the device. Additionally,
the 73M2901/3.3V provides an on-chip oscillator and
Hybrid driver.
The 73M2901/3.3V is a high performance, low
voltage, low power, single chip modem capable of
data transmission and reception through 2400bps.
The 73M2901/3.3V is intended for embedded
applications and battery operation. This device
offers low power 3.3 volt design with optional
internal hybrid and country specific call progress
support.
• Low overall system chip count. True one
chip solution for embedded systems
• Low operating power (~120mW @ 3.3V,
automatic low power standby and power
down options available)
• Internal ROM and RAM for normal operation
• On chip optional hybrid driver
• Designed for +3.15 through +3.6 volts
• Data speeds:
V.22bis – 2400bps
V.22, Bell 212 – 1200bps
V.21, Bell 103 – 300bps
V.23 – 1200/75bps (w/ turnaround (PAVI))
Bell 202 – 1200bps
Bell 202 and V23 4-wire operations
• Dynamic Range: -9dBm to –43 dBm
• “AT” command set
• Host access to modem port pins via AT
commands for custom I/O expansion
• DTMF tone generation and detection
• Call progress support with multinational
options (FCC68, CTR21, JATE…)
• Caller ID capability
• Blacklisting capability
• Packaging: 32 pin PLCC or 44 pin TQFP
BLOCK DIAGRAM
ASRCH
RING
DTR
TxCLK
TxD
RxD
RxCLK
RI
CTS
DCD
DSR
RTS
RAM
CPU
ROM
MAC
AFE ^Hybrid
USR10
USR11
RELAY
HBDEN
RxA
TxAP
TxAP