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MBRA320T3G Datasheet, PDF (1/3 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier
Surface Mount Schottky Power Rectifier
FEATURES
•ăSmall Compact Surface Mountable Package with J-Bent Leads
•ăRectangular Package for Automated Handling
•ăHighly Stable Oxide Passivated Junction
•ăVery Low Forward Voltage Drop
•ăGuardring for Stress Protection
•ăPb-Free Package is Available
MBRA320T3G
20V 3.0A
MECHANICAL DATA
•ăCase: Epoxy, Molded
•ăWeight: 70 mg (approximately)
•ăFinish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•ăLead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•ăShipped in 12 mm tape, 5000 units per 13 inch reel
•ăPolarity: Cathode Lead Indicated by Polarity Band
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TL = 100°C)
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
Symbol
VRRM
VRWM
VR
IO
IFSM
Value
20
3.0
80
Unit
V
A
A
Tstg
TJ
dv/dt
-65 to +150
-65 to +125
10,000
°C
°C
V/ms
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance - Junction-to-Lead (Note 1)
Thermal Resistance - Junction-to-Ambient (Note 1)
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
Maximum Instantaneous Reverse Current (Note 2)
(IF = 3.0 A, TJ = 25°C)
(VR = 20 V)
Symbol
RθJL
RθJA
VF
IR
1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4.
2. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%.
Value
15
80
0.50
TJ = 25°C
2.0
TJ = 100°C
20
Unit
°C/W
Volts
mA
E-mail: sales@taychipst.com
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