MBRA210ET3 Datasheet, PDF (1/3 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier

Surface Mount Schottky Power Rectifier
FEATURES
• Low I_R, Extends Battery Life
• 1st in the Market Place with a 10 V_R Schottky Rectifier
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guardring for Over−Voltage Protection
• Optimized for Low Leakage Current
• Pb−Free Package is Available
MBRA210ET3
10V 2.0A
MECHANICAL DATA
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Polarity Band Indicates Cathode Lead
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V_RRM
10
V
V_RWM
V_R
Average Rectified Forward Current
(At Rated V_R, T_C = 125°C)
I_O
2.0
A
Non−Repetitive Peak Surge Current
I_FSM
100
A
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Storage/Operating Case Temperature
T_stg, T_C
−65 to +150
°C
Operating Junction Temperature
T_J
−65 to +150
°C
Voltage Rate of Change
(Rated V_R, T_J = 25°C)
dv/dt
10,000
V/ms
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
ELECTRICAL CHARACTERISTICS
R_qJL
R_qJA
Maximum Instantaneous Forward Voltage (Note 2)
V_F
(I_F = 0.1 A)
(I_F = 1.0 A)
(I_F = 2.0 A)
Maximum Instantaneous Reverse Current
I_R
(V_R = 5.0 V)
(V_R = 10 V)
1. Mounted on a 3″ square FR4 PC Board with min. pads or 1″ square copper heat spreader.
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
Min Pad
22
150
T_J = 25°C
0.405
0.480
0.500
T_J = 25°C
15
50
1 Inch Pad
15
81
Unit
°C/W
T_J = 100°C
V
0.275
0.355
0.385
T_J = 100°C
mA
200
500
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